Security Acoustics a division of Security Metal Products Corp. (SMPC), supplies the world with cutting-edge acoustics products. Our Chairman and CEO, Michael Hirsch, is a third generation standard and custom door manufacturer. SMPC's original sound reduction door division, Hirsch-Krieger, pioneered major technological advances in the industry.

Our vision is to successfully contribute to the advancement of microelectronics by addressing and implementing the current and future requirements of the fast-moving Advanced Packaging Market.

Call Boxes

Comarco Wireless Technologies has been a leading provider of call box systems since 1985. Call Boxes are an effective way to provide reliable communications and improve safety along metropolitan freeways, bridges, tunnels, commuter parking lots rest areas, and rural highways.

Die Attach - Flip Chip Technology at die-attach.net

Datacon as a leading equipment supplier in the die attach advanced packaging technology is offering you the ideal solution as well for your die attach applications as for your Flip Chip applications.

Die Attach Dispensing at die-attach-dispensing.com

Die Attach Dispensing System û Spindle Dispenser and Time/Pressure Dispenser available. Free programmable dispense pattern.

Die Bonding at die-bonding.net

With its latest Multi-Chip Die Bonder, the 2200 apm+, Datacon meets the newest challenges of many users. The industry proven platform concept and the superior flexibility of the 2200 apm are now available on the 2200 apm+, with the added capability of handling wafers up to 300 mm and die up to 50 mm.

Flexible Die Attach Solutions at flexible-die-attach-solutions.com

Datacon has concentrated on the advanced packaging market since 1986, focusing on die bonding and flip chip technologies.

Flip Chip Bonder at flip-chip-bonder.net

With a large flip chip installed base, Datacon - the flip chip pioneer from the very beginning - proudly presents to you the powerful 8800 FC high-speed, high-accuracy platform for a wide range of flip chip processes.

Flip Chip Die Attach at flip-chip-die-attach.com

Datacon Flip Chip Die Attach is pioneer from the very beginning offers you the ideal system for series production in this highly sophisticated technology. The steps flip the component by 180 ?, cover it in the dipping unit, position the component can be processed in just one module.

Flip Chip Die Bonder at flip-chip-die-bonder.com

flip-chip-die-bonder.com take pride in offering you Flip Chip Die Bonder solutions as well for your die attach applications as for your Flip Chip applications.